IEC/PAS 62326-14-2010 印刷电路板.第14部分:设备嵌入式基底.术语/可靠性/设计指南
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【英文标准名称】:Printedboards-Part14:Deviceembeddedsubstrate-Terminology/reliability/designguide
【原文标准名称】:印刷电路板.第14部分:设备嵌入式基底.术语/可靠性/设计指南
【标准号】:IEC/PAS62326-14-2010
【标准状态】:现行
【国别】:国际
【发布日期】:2010-09
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC91
【标准类型】:()
【标准水平】:()
【中文主题词】:基底材料;组件;设计;双面印制电路板;电气工程;电子工程;电子设备及元件;柔性;微电子学;印制电路;印制电路板;质量;质量保证;可靠性;术语;试验;外观检查(测试)
【英文主题词】:Basematerials;Components;Design;Double-sidedprintedboards;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Flexible;Microelectronics;Printedcircuits;Printed-circuitboards;Quality;Qualityassurance;Reliability;Terminology;Testing;Visualinspection(testing)
【摘要】:ThisPASisapplicabletodeviceembeddedsubstratesfabricatedbyembeddingdiscreteactiveandpassiveelectronicdevicesintoaninnerlayerofasubstratewithelectricconnectionsbyvias,conductorplating,conductivepaste,andprinting.ThedeviceembeddedsubstratemaybeusedasasubstratetomountSMDstoformelectroniccircuits,asconductorandinsulatorlayersmaybeformedafterembeddingelectronicdevices.ThepurposeofthisPASistoobtaincommonunderstandingindesign,fabricationanduseofdeviceembeddedsubstratesintheindustry.ThisPASdescribesthesubstrateembeddingdevicesincludingbutnotlimitedtomodule,integratedpassivedevice(IPD),microelectrochemicalsystems(MEMS),discretecomponentformedinthefabricationprocessoftheelectronicwiringboard,andsheetformcomponent.Figure1showsexamplesofdeviceembeddinginthefabricationprocessofthedeviceembeddedsubstrate.Activeandpassivedevicesareconnectedtoeachotherbyinterlayerviasand/orconductorpatterns.Insulatinglayersareformedusinginsulatingmaterialswithviasfortheconnectionofinsideconductorpatternstotheconductorpatternsformedonthesurface(s)ofthesubstrate.Figure2showsthesubstratewithconnectionsusingpads,andFigure3showstheboardusingviaconnections.Theinsulatinglayerincludesrigidandflexibleinsulatingresinssuchasphenolresin,epoxyresin,polyimideresinandmodifiedpolyimideresin,whicharereinforcedwithglasscloth,aramidclothorpaper;andresinswithoutreinforcement.InterconnectionstotheinputandoutputterminalstotheembeddeddeviceandthesurfaceconductorpatternincludeconventionalinterconnectionoftheterminalsoftheembeddeddevicetoaninterconnectinglandforSMD,andformationofterminalsonthesurfaceofanembeddeddevicebycopperplatingorviasusingconductivepaste.ThisPASdoesnotspecifythefabricationprocessofdeviceembeddedsubstrates,viadiameter/vialanddiameter,conductorwidth/conductorspacingnorconductorlinedensity.
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:66P.;A4
【正文语种】:英语
【原文标准名称】:印刷电路板.第14部分:设备嵌入式基底.术语/可靠性/设计指南
【标准号】:IEC/PAS62326-14-2010
【标准状态】:现行
【国别】:国际
【发布日期】:2010-09
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC91
【标准类型】:()
【标准水平】:()
【中文主题词】:基底材料;组件;设计;双面印制电路板;电气工程;电子工程;电子设备及元件;柔性;微电子学;印制电路;印制电路板;质量;质量保证;可靠性;术语;试验;外观检查(测试)
【英文主题词】:Basematerials;Components;Design;Double-sidedprintedboards;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Flexible;Microelectronics;Printedcircuits;Printed-circuitboards;Quality;Qualityassurance;Reliability;Terminology;Testing;Visualinspection(testing)
【摘要】:ThisPASisapplicabletodeviceembeddedsubstratesfabricatedbyembeddingdiscreteactiveandpassiveelectronicdevicesintoaninnerlayerofasubstratewithelectricconnectionsbyvias,conductorplating,conductivepaste,andprinting.ThedeviceembeddedsubstratemaybeusedasasubstratetomountSMDstoformelectroniccircuits,asconductorandinsulatorlayersmaybeformedafterembeddingelectronicdevices.ThepurposeofthisPASistoobtaincommonunderstandingindesign,fabricationanduseofdeviceembeddedsubstratesintheindustry.ThisPASdescribesthesubstrateembeddingdevicesincludingbutnotlimitedtomodule,integratedpassivedevice(IPD),microelectrochemicalsystems(MEMS),discretecomponentformedinthefabricationprocessoftheelectronicwiringboard,andsheetformcomponent.Figure1showsexamplesofdeviceembeddinginthefabricationprocessofthedeviceembeddedsubstrate.Activeandpassivedevicesareconnectedtoeachotherbyinterlayerviasand/orconductorpatterns.Insulatinglayersareformedusinginsulatingmaterialswithviasfortheconnectionofinsideconductorpatternstotheconductorpatternsformedonthesurface(s)ofthesubstrate.Figure2showsthesubstratewithconnectionsusingpads,andFigure3showstheboardusingviaconnections.Theinsulatinglayerincludesrigidandflexibleinsulatingresinssuchasphenolresin,epoxyresin,polyimideresinandmodifiedpolyimideresin,whicharereinforcedwithglasscloth,aramidclothorpaper;andresinswithoutreinforcement.InterconnectionstotheinputandoutputterminalstotheembeddeddeviceandthesurfaceconductorpatternincludeconventionalinterconnectionoftheterminalsoftheembeddeddevicetoaninterconnectinglandforSMD,andformationofterminalsonthesurfaceofanembeddeddevicebycopperplatingorviasusingconductivepaste.ThisPASdoesnotspecifythefabricationprocessofdeviceembeddedsubstrates,viadiameter/vialanddiameter,conductorwidth/conductorspacingnorconductorlinedensity.
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:66P.;A4
【正文语种】:英语
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